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CC2530F32, CC2530F64, CC2530F128, CC2530F256
www.ti.com .......................................................................................................................................................... SWRS081A - APRIL 2009 - REVISED APRIL 2009
A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications
1FEATURES 2345*
*
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RF/Layout - 2.4-GHz IEEE 802.15.4 Compliant RF Transceiver - Excellent Receiver Sensitivity and Robustness to Interference - Programmable Output Power Up to 4.5 dBm - Very Few External Components - Only a Single Crystal Needed for Mesh Network Systems - 6-mm x 6-mm QFN40 Package - Suitable for Systems Targeting Compliance With Worldwide Radio-Frequency Regulations: ETSI EN 300 328 and EN 300 440 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T-66 (Japan) Low Power - Active-Mode RX (CPU Idle): 24 mA - Active Mode TX at 1 dBm (CPU Idle): 29 mA - Power Mode 1 (4 s Wake-Up): 0.2 mA - Power Mode 2 (Sleep Timer Running): 1 A - Power Mode 3 (External Interrupts): 0.4 A - Wide Supply-Voltage Range (2 V-3.6 V) Microcontroller - High-Performance and Low-Power 8051 Microcontroller Core With Code Prefetch - 32-, 64-, 128-, or 256-KB In-System-Programmable Flash - 8-KB RAM With Retention in All Power Modes - Hardware Debug Support Peripherals - Powerful Five-Channel DMA - IEEE 802.15.4 MAC Timer, General-Purpose Timers (One 16-Bit, Two 8-Bit) - IR Generation Circuitry - 32-kHz Sleep Timer With Capture - CSMA/CA Hardware Support
*
- Accurate Digital RSSI/LQI Support - Battery Monitor and Temperature Sensor - 12-Bit ADC With Eight Channels and Configurable Resolution - AES Security Coprocessor - Two Powerful USARTs With Support for Several Serial Protocols - 21 General-Purpose I/O Pins (19x 4 mA, 2x 20 mA) - Watchdog Timer Development Tools - CC2530 Development Kit - CC2530 ZigBee(R) Development Kit - CC2530 RemoTITM Development Kit for RF4CE - SmartRFTM Software - Packet Sniffer - IAR Embedded WorkbenchTM Available
APPLICATIONS
* * * * * * * * * 2.4-GHz IEEE 802.15.4 Systems RF4CE Remote Control Systems (64-KB Flash and Higher) ZigBee Systems (256-KB Flash) Home/Building Automation Lighting Systems Industrial Control and Monitoring Low-Power Wireless Sensor Networks Consumer Electronics Health Care
*
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2
3
4
5
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. RemoTI, SmartRF, Z-Stack are trademarks of Texas Instruments. IAR Embedded Workbench is a trademark of IAR Systems AB. ZigBee is a registered trademark of the ZigBee Alliance. All other trademarks are the property of their respective owners.
Copyright (c) 2009, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
CC2530F32, CC2530F64, CC2530F128, CC2530F256
SWRS081A - APRIL 2009 - REVISED APRIL 2009 .......................................................................................................................................................... www.ti.com
DESCRIPTION
The CC2530 is a true system-on-chip (SoC) solution for IEEE 802.15.4, Zigbee and RF4CE applications. It enables robust network nodes to be built with very low total bill-of-material costs. The CC2530 combines the excellent performance of a leading RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful features. The CC2530 comes in four different flash versions: CC2530F32/64/128/256, with 32/64/128/256 KB of flash memory, respectively. The CC2530 has various operating modes, making it highly suited for systems where ultralow power consumption is required. Short transition times between operating modes further ensure low energy consumption. Combined with the industry-leading and golden-unit-status ZigBee protocol stack (Z-StackTM) from Texas Instruments, the CC2530F256 provides a robust and complete ZigBee solution. Combined with the golden-unit-status RemoTI stack from Texas Instruments, the CC2530F64 and higher provide a robust and complete ZigBee RF4CE remote-control solution.
DIGITAL ANALOG MIXED 32-MHz CRYSTAL OSC 32.768-kHz CRYSTAL OSC DEBUG INTERFACE HIGH-SPEED RC-OSC 32-kHz RC-OSC CLOCK MUX and CALIBRATION POWER ON RESET BROWN OUT RESET WATCHDOG TIMER ON-CHIP VOLTAGE REGULATOR VDD (2 V-3.6 V) DCOUPL
RESET_N XOSC_Q2 XOSC_Q1 P2_4 P2_3 P2_2 P2_1 P2_0 P1_7
SLEEP TIMER
SLEEP MODE CONTROLLER
32/64/128/256-KB FLASH DMA 8051 CPU CORE MEMORY ARBITRATOR 8-KB SRAM
I/O CONTROLLER
P1_6 P1_5 P1_4 P1_3 P1_2 P1_1 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0
IRQ CTRL ADC AUDIO/DC 8 CHANNELS AES ENCRYPTION AND DECRYPTION
FLASH WRITE
RADIO REGISTERS
CSMA/CA STROBE PROCESSOR
USART 2
DEMODULATOR
AGC
MODULATOR
TIMER 1 (16-Bit)
TIMER 2 (IEEE 802.15.4 MAC TIMER) RECEIVE CHAIN
FREQUENCY SYNTHESIZER
TIMER 3 (8-Bit)
TRANSMIT CHAIN
TIMER 4 (8-Bit)
RF_P
RF_N
B0300-02
2
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FIFO and FRAME CONTROL
USART 1
RADIO DATA INTERFACE
CC2530F32, CC2530F64, CC2530F128, CC2530F256
www.ti.com .......................................................................................................................................................... SWRS081A - APRIL 2009 - REVISED APRIL 2009
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS (1)
MIN Supply voltage Voltage on any digital pin Input RF level Storage temperature range ESD (2) All pads, according to human-body model, JEDEC STD 22, method A114 According to charged-device model, JEDEC STD 22, method C101 (1) (2) -40 All supply pins must have the same voltage -0.3 -0.3 MAX 3.9 VDD + 0.3, 3.9 10 125 2 500 UNIT V V dBm C kV V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS
MIN Operating ambient temperature range, TA Operating supply voltage -40 2 MAX 125 3.6 UNIT C V
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25C and VDD = 3 V, unless otherwise noted. Boldface limits apply over the entire operating range, TA = -40C to 125C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz.
PARAMETER TEST CONDITIONS Digital regulator on. 16-MHz RCOSC running. No radio, crystals, or peripherals active. Medium CPU activity: normal flash access (1), no RAM access 32-MHz XOSC running. No radio or peripherals active. Medium CPU activity: normal flash access (1), no RAM access 32-MHz XOSC running, radio in RX mode, -50-dBm input power, no peripherals active, CPU idle 32-MHz XOSC running, radio in RX mode at -100-dBm input power (waiting for signal), no peripherals active, CPU idle Icore Core current consumption 32-MHz XOSC running, radio in TX mode, 1-dBm output power, no peripherals active, CPU idle 32-MHz XOSC running, radio in TX mode, 4.5-dBm output power, no peripherals active, CPU idle Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention MIN TYP MAX UNIT 3.4 mA
6.5 20.5 24.3 28.7 33.5 0.2
8.9
mA mA
29.6
mA mA
39.6 0.3
mA mA
1 0.4
2 1
A A
(1)
Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently. Submit Documentation Feedback 3
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ELECTRICAL CHARACTERISTICS (continued)
Measured on Texas Instruments CC2530 EM reference design with TA = 25C and VDD = 3 V, unless otherwise noted. Boldface limits apply over the entire operating range, TA = -40C to 125C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz.
PARAMETER Timer 1 Timer 2 Timer 3 Iperi Timer 4 Sleep timer ADC Flash TEST CONDITIONS Timer running, 32-MHz XOSC used Timer running, 32-MHz XOSC used Timer running, 32-MHz XOSC used Timer running, 32-MHz XOSC used Including 32.753-kHz RCOSC When converting Erase Burst write peak current MIN TYP MAX UNIT 90 90 60 70 0.6 1.2 1 6 A A A A A mA mA mA Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)
4
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GENERAL CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25C and VDD = 3 V, unless otherwise noted.
PARAMETER WAKE-UP AND TIMING Power mode 1 active Power mode 2 or 3 active Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16-MHz RCOSC Initially running on 16-MHz RCOSC, with 32-MHz XOSC OFF With 32-MHz XOSC initially on RX/TX and TX/RX turnaround RADIO PART RF frequency range Radio baud rate Radio chip rate Programmable in 1-MHz steps, 5 MHz between channels for compliance with [1] As defined by [1] As defined by [1] 2394 250 2 2507 MHz kbps MChip/s 4 0.1 0.5 192 192 s ms ms s s TEST CONDITIONS MIN TYP MAX UNIT
Active TX or RX
RF RECEIVE SECTION
Measured on Texas Instruments CC2530 EM reference design with TA = 25C, VDD = 3 V, and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = -40C to 125C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz.
PARAMETER Receiver sensitivity Saturation (maximum input level) Adjacent-channel rejection, 5-MHz channel spacing Adjacent-channel rejection, -5-MHz channel spacing Alternate-channel rejection, 10-MHz channel spacing Alternate-channel rejection, -10-MHz channel spacing Channel rejection 20 MHz -20 MHz Co-channel rejection Blocking/desensitization 5 MHz from band edge 10 MHz from band edge 20 MHz from band edge 50 MHz from band edge -5 MHz from band edge -10 MHz from band edge -20 MHz from band edge -50 MHz from band edge Wanted signal 3 dB above the sensitivity level, CW jammer, PER = 1%. Measured according to EN 300 440 class 2. -33 -33 -32 -31 -35 -35 -34 -34 TEST CONDITIONS PER = 1%, as specified by [1] [1] requires -85 dBm PER = 1%, as specified by [1] [1] requires -20 dBm Wanted signal -82 dBm, adjacent modulated channel at 5 MHz, PER = 1 %, as specified by [1]. [1] requires 0 dB Wanted signal -82 dBm, adjacent modulated channel at -5 MHz, PER = 1 %, as specified by [1]. [1] requires 0 dB Wanted signal -82 dBm, adjacent modulated channel at 10 MHz, PER = 1%, as specified by [1] [1] requires 30 dB Wanted signal -82 dBm, adjacent modulated channel at -10 MHz, PER = 1 %, as specified by [1] [1] requires 30 dB Wanted signal at -82 dBm. Undesired signal is an IEEE 802.15.4 modulated channel, stepped through all channels from 2405 to 2480 MHz. Signal level for PER = 1%. Wanted signal at -82 dBm. Undesired signal is 802.15.4 modulated at the same frequency as the desired signal. Signal level for PER = 1%. MIN TYP MAX -97 -92 -88 UNIT dBm dBm
10
49
dB
49
dB
57
dB
57
dB
57 57 -3
dB
dB
dBm
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RF RECEIVE SECTION (continued)
Measured on Texas Instruments CC2530 EM reference design with TA = 25C, VDD = 3 V, and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = -40C to 125C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Spurious emission. Only largest spurious emission stated within each band. Conducted measurement with a 50- single-ended load. Suitable for systems targeting compliance with EN 300 328, 30 MHz-1000 MHz EN 300 440, FCC CFR47 Part 15 and ARIB STD-T-66. 1 GHz-12.75 GHz Frequency error tolerance (1) Symbol rate error tolerance (2) (1) (2) [1] requires minimum 80 ppm [1] requires minimum 80 ppm
< -80 -57 150 1000
dBm
ppm ppm
Difference between center frequency of the received RF signal and local oscillator frequency. Difference between incoming symbol rate and the internally generated symbol rate
RF TRANSMIT SECTION
Measured on Texas Instruments CC2530 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = -40C to 125C, VDD = 2 V to 3.6 V and fc = 2394 MHz to 2507 MHz.
PARAMETER Nominal output power Programmable output power range Spurious emissions Measured conducted according to stated regulations. Only largest spurious emission stated within each band. Max recommended output power setting (1) 25 MHz-1000 MHz (outside restricted bands) 25 MHz-2400 MHz (within FCC restricted bands) 25 MHz-1000 MHz (within ETSI restricted bands) 1800-1900 MHz (ETSI restricted band) 5150-5300 MHz (ETSI restricted band) At 2 x fc and 3 x fc (FCC restricted band) At 2 x fc and 3 x fc (ETSI EN 300-440 and EN 300-328) (2) 1 GHz-12.75 GHz (outside restricted bands) At 2483.5 MHz and above (FCC restricted band) fc= 2480 MHz (3) Measured as defined by [1] using maximum-recommended output-power setting [1] requires maximum 35%. Differential impedance as seen from the RF port (RF_P and RF_N) towards the antenna -60 -60 -60 -57 -55 -42 -31 -53 -42 2% 69 + j29 TEST CONDITIONS Delivered to a single-ended 50- load through a balun using maximum-recommended output-power setting [1] requires minimum -3 dBm MIN 0 -8 TYP 4.5 32 MAX 8 10 UNIT dBm dB
dBm
Error vector magnitude (EVM) Optimum load impedance (1) (2) (3)
Texas Instruments CC2530 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T-66. Margins for passing conducted requirements at the third harmonic can be improved by using a simple band-pass filter connected between matching network and RF connector (1.8 pF in parallel with 1.6 nH); this filter must be connected to a good RF ground. Margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz can be improved by using a lower output-power setting or having less than 100% duty cycle.
6
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32-MHz CRYSTAL OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25C and VDD = 3 V, unless otherwise noted.
PARAMETER Crystal frequency Crystal frequency accuracy requirement (1) ESR C0 CL Equivalent series resistance Crystal shunt capacitance Crystal load capacitance Start-up time The crystal oscillator must be in power down for a guard time before it is used again. This requirement is valid for all modes of operation. The need for power-down guard time can vary with crystal type and load. -40 6 1 10 0.3 TEST CONDITIONS MIN TYP 32 40 60 7 16 MAX UNIT MHz ppm pF pF ms
Power-down guard time
3
ms
(1)
Including aging and temperature dependency, as specified by [1]
32.768-kHz CRYSTAL OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25C and VDD = 3 V, unless otherwise noted.
PARAMETER Crystal frequency Crystal frequency accuracy requirement (1) ESR C0 CL Equivalent series resistance Crystal shunt capacitance Crystal load capacitance Start-up time (1) Including aging and temperature dependency, as specified by [1] -40 40 0.9 12 0.4 TEST CONDITIONS MIN TYP 32.768 40 130 2 16 MAX UNIT kHz ppm pF pF s
32-kHz RC OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25C and VDD = 3 V, unless otherwise noted.
PARAMETER Calibrated frequency (1) Frequency accuracy after calibration Temperature coefficient (2) Supply-voltage coefficient Calibration time (4) (1) (2) (3) (4)
(3)
TEST CONDITIONS
MIN
TYP 32.753 0.2% 0.4 3 2
MAX
UNIT kHz %/C %/V ms
The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977. Frequency drift when temperature changes after calibration Frequency drift when supply voltage changes after calibration When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC32K_CALDIS is 0.
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16-MHz RC OSCILLATOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25C and VDD = 3 V, unless otherwise noted.
PARAMETER Frequency (1) Uncalibrated frequency accuracy Calibrated frequency accuracy Start-up time Initial calibration time (2) (1) (2) 50 TEST CONDITIONS MIN TYP 16 18% 0.6% 1% 10 s s MAX UNIT MHz
The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2. When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC_PD is set to 0.
RSSI/CCA CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25C and VDD = 3 V, unless otherwise noted.
PARAMETER RSSI range Absolute uncalibrated RSSI/CCA accuracy RSSI/CCA offset (1) Step size (LSB value) (1) Real RSSI = Register value - offset TEST CONDITIONS MIN TYP 100 4 73 1 MAX UNIT dB dB dB dB
FREQEST CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25C and VDD = 3 V, unless otherwise noted.
PARAMETER FREQEST range FREQEST accuracy FREQEST offset (1) Step size (LSB value) (1) Real FREQEST = Register value - offset TEST CONDITIONS MIN TYP 250 40 20 7.8 MAX UNIT kHz kHz kHz kHz
FREQUENCY SYNTHESIZER CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted.
PARAMETER Phase noise, unmodulated carrier TEST CONDITIONS At 1-MHz offset from carrier At 2-MHz offset from carrier At 5-MHz offset from carrier MIN TYP -110 -117 -122 dBc/Hz MAX UNIT
ANALOG TEMPERATURE SENSOR
Measured on Texas Instruments CC2530 EM reference design with TA = 25C and VDD = 3 V, unless otherwise noted.
PARAMETER Output at 25C Temperature coefficient Voltage coefficient Initial accuracy without calibration Accuracy using 1-point calibration (entire temperature range) Current consumption when enabled (ADC current not included) Measured using integrated ADC using internal bandgap voltage reference and maximum resolution TEST CONDITIONS MIN TYP 1480 4.5 1 10 5 0.5 MAX UNIT 12-bit ADC /10C /0.1 V C C mA
8
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ADC CHARACTERISTICS
TA = 25C and VDD = 3 V, unless otherwise noted.
PARAMETER Input voltage External reference voltage External reference voltage differential Input resistance, signal Full-scale signal (1) TEST CONDITIONS VDD is voltage on AVDD5 pin VDD is voltage on AVDD5 pin VDD is voltage on AVDD5 pin Using 4-MHz clock speed Peak-to-peak, defines 0 dBFS Single-ended input, 7-bit setting Single-ended input, 9-bit setting Single-ended input, 10-bit setting ENOB (1) Effective number of bits Single-ended input, 12-bit setting Differential input, 7-bit setting Differential input, 9-bit setting Differential input, 10-bit setting Differential input, 12-bit setting Useful power bandwidth THD (1) 7-bit setting, both single and differential Single-ended input, 12-bit setting, -6 dBFS Total harmonic distortion Differential input, 12-bit setting, -6 dBFS Single-ended input, 12-bit setting Signal to nonharmonic ratio (1) Differential input, 12-bit setting Single-ended input, 12-bit setting, -6 dBFS Differential input, 12-bit setting, -6 dBFS CMRR Common-mode rejection ratio Crosstalk Offset Gain error DNL (1) INL (1) Differential nonlinearity Integral nonlinearity 12-bit setting, mean 12-bit setting, maximum 12-bit setting, mean 12-bit setting, maximum Single-ended input, 7-bit setting Single-ended input, 9-bit setting Single-ended input, 10-bit setting SINAD (-THD+N)
(1)
MIN 0 0 0
TYP MAX VDD VDD VDD 197 2.97 5.7 7.5 9.3 10.8 6.5 8.3 10.0 11.5 0-20 -75. 2 -86. 6 70.2 79.3 78.8 88.9 >84 >84 -3 0.68 0.05 0.9 4.6 13.3 35.4 46.8 57.5 66.6 40.7 51.6 61.8 70.8 20 36 68 132 1.2 1.15
UNIT V V V k V
bits
kHz
dB
dB
Differential input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution Single-ended input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution Midscale
dB dB mV % LSB LSB
Signal-to-noise-and-distortion
Single-ended input, 12-bit setting Differential input, 7-bit setting Differential input, 9-bit setting Differential input, 10-bit setting Differential input, 12-bit setting 7-bit setting 9-bit setting 10-bit setting 12-bit setting
dB
Conversion time
s
Power consumption Internal reference voltage (1) Measured with 300-Hz sine-wave input and VDD as reference.
mA V
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ADC CHARACTERISTICS (continued)
TA = 25C and VDD = 3 V, unless otherwise noted.
PARAMETER Internal reference VDD coefficient Internal reference temperature coefficient TEST CONDITIONS MIN TYP MAX 4 0.4 UNIT mV/V mV/10C
CONTROL INPUT AC CHARACTERISTICS
TA = -40C to 125C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER System clock, fSYSCLK tSYSCLK = 1/fSYSCLK TEST CONDITIONS The undivided system clock is 32 MHz when crystal oscillator is used. The undivided system clock is 16 MHz when calibrated 16-MHz RC oscillator is used. See item 1, Figure 1. This is the shortest pulse that is recognized as a complete reset pin request. Note that shorter pulses may be recognized but might not lead to complete reset of all modules within the chip. See item 2, Figure 1.This is the shortest pulse that is recognized as an interrupt request. MIN 16 TYP MAX 32 UNIT MHz
RESET_N low duration
1
s
Interrupt pulse duration
20
ns
RESET _N
1
2
Px.n
T0299-01
Figure 1. Control Input AC Characteristics
10
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SPI AC CHARACTERISTICS
TA = -40C to 125C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER t1 t2 t3 t4 t7 t6 t5 t1 t2 t3 t6 t5 t5 SCK period SCK duty cycle SSN low to SCK SCK to SSN high MO early out MO late out MI setup MI hold SCK period SCK duty cycle SSN low to SCK SCK to SSN high MO setup MO hold MI late out Master Master Master Master, load = 10 pF Master, load 10 = pF Master Master Slave, Rx and Tx Slave Slave Slave Slave Slave Slave, load = 10 pF Master, Tx only Operating frequency Master, Rx and Tx Slave, Rx only Slave, Rx and Tx
t1
TEST CONDITIONS Master, Rx and Tx
MIN 250
TYP 50%
MAX
UNIT ns ns ns
63 63 7 10 90 10 250 50% 63 63 35 10 95 8 4 8 4
ns ns ns ns ns ns ns ns ns ns
MHz
SCK
t2
t3
SSN
MO (Master Out, Slave In)
t4
t7
MI (Master In, Slave Out)
t5 t6
T0439-01
Figure 2. SPI AC Characteristics
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DEBUG INTERFACE AC CHARACTERISTICS
TA = -40C to 125C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER fclk_dbg t1 t2 t3 t4 t5 t6 t7 t8 Debug clock frequency (see Figure 3) Allowed high pulse on clock (see Figure 3) Allowed low pulse on clock (see Figure 3) EXT_RESET_N low to first falling edge on debug clock (see Figure 4) Falling edge on clock to EXT_RESET_N high (see Figure 4) EXT_RESET_N high to first debug command (see Figure 4) Debug data setup (see Figure 5) Debug data hold (see Figure 5) Clock-to-data delay (see Figure 5) Load = 10 pF 35 35 167 83 83 2 4 30 TEST CONDITIONS MIN TYP MAX 12 UNIT MHz ns ns ns ns ns ns ns ns
Time
DEBUG CLK _ P2_2
t1 1/fclk_dbg
t2
T0436-01
Figure 3. Debug Clock - Basic Timing
Time
DEBUG CLK _ P2_2
RESET _N
t3
t4
t5
T0437-01
Figure 4. Data Setup and Hold Timing
12
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Time
DEBUG CLK _ P2_2
DEBUG _DATA (to CC2530) P2_1
DEBUG _DATA (from CC2530) P2_1
t6
t7
t8
T0438-01
Figure 5. Debug Enable Timing
TIMER INPUTS AC CHARACTERISTICS
TA = -40C to 125C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER Input capture pulse duration TEST CONDITIONS Synchronizers determine the shortest input pulse that can be recognized. The synchronizers operate at the current system clock rate (16 or 32 MHz). MIN 1.5 TYP MAX UNIT tSYSCLK
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DC CHARACTERISTICS
TA = 25C, VDD = 3 V, unless otherwise noted.
PARAMETER Logic-0 input voltage Logic-1 input voltage Logic-0 input current Logic-1 input current I/O-pin pullup and pulldown resistors Logic-0 output voltage, 4-mA pins Logic-1 output voltage, 4-mA pins Logic-0 output voltage, 20-mA pins Logic-1 output voltage, 20-mA pins Output load 4 mA Output load 4 mA Output load 20 mA Output load 20 mA 2.4 2.4 0.5 Input equals 0 V Input equals VDD 2.5 -50 -50 20 0.5 50 50 TEST CONDITIONS MIN TYP MAX 0.5 UNIT V V nA nA k V V V V
DEVICE INFORMATION PIN DESCRIPTIONS
The CC2530 pinout is shown in Figure 6 and a short description of the pins follows.
CC2530 RHA Package (Top View) P2_3/XOSC32K_Q2 P2_4/XOSC32K_Q1
32
DCOUPL
DVDD1
P1_6
P1_7
P2_0
P2_1
P2_2
GND GND GND GND P1_5 P1_4 P1_3 P1_2 P1_1 DVDD2
1 2 3 4 5 6 7 8
40
39
38
37
36
35
34
33
31 30 29 28 27
AVDD6
RBIAS AVDD4 AVDD1 AVDD2 RF_N RF_P AVDD3 XOSC_Q2 XOSC_Q1 AVDD5
GND Ground Pad
26 25 24 23 22
10 11
9
12
13
14
15
16
17
18
19
21 20
P0_1
RESET_N
P1_0
P0_4
P0_2
P0_7
P0_6
P0_5
P0_3
P0_0
P0076-02
NOTE: The exposed ground pad must be connected to a solid ground plane, as this is the ground connection for the chip.
Figure 6. Pinout Top View
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Pin Descriptions
PIN NAME AVDD1 AVDD2 AVDD3 AVDD4 AVDD5 AVDD6 DCOUPL DVDD1 DVDD2 GND GND P0_0 P0_1 P0_2 P0_3 P0_4 P0_5 P0_6 P0_7 P1_0 P1_1 P1_2 P1_3 P1_4 P1_5 P1_6 P1_7 P2_0 P2_1 P2_2 P2_3/ XOSC32K_Q2 P2_4/ XOSC32K_Q1 RBIAS RESET_N RF_N RF_P XOSC_Q1 XOSC_Q2 PIN 28 27 24 29 21 31 40 39 10 -- 1, 2, 3, 4 19 18 17 16 15 14 13 12 11 9 8 7 6 5 38 37 36 35 34 33 32 30 20 26 25 22 23 PIN TYPE Power (analog) Power (analog) Power (analog) Power (analog) Power (analog) Power (analog) Power (digital) Power (digital) Power (digital) Ground Unused pins Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O, Analog I/O Digital I/O, Analog I/O Analog I/O Digital input RF I/O RF I/O Analog I/O Analog I/O DESCRIPTION 2-V-3.6-V analog power-supply connection 2-V-3.6-V analog power-supply connection 2-V-3.6-V analog power-supply connection 2-V-3.6-V analog power-supply connection 2-V-3.6-V analog power-supply connection 2-V-3.6-V analog power-supply connection 1.8-V digital power-supply decoupling. Do not use for supplying external circuits. 2-V-3.6-V digital power-supply connection 2-V-3.6-V digital power-supply connection The ground pad must be connected to a solid ground plane. Connect to GND Port 0.0 Port 0.1 Port 0.2 Port 0.3 Port 0.4 Port 0.5 Port 0.6 Port 0.7 Port 1.0 - 20-mA drive capability Port 1.1 - 20-mA drive capability Port 1.2 Port 1.3 Port 1.4 Port 1.5 Port 1.6 Port 1.7 Port 2.0 Port 2.1 Port 2.2 Port 2.3/32.768 kHz XOSC Port 2.4/32.768 kHz XOSC External precision bias resistor for reference current Reset, active-low Negative RF input signal to LNA during RX Negative RF output signal from PA during TX Positive RF input signal to LNA during RX Positive RF output signal from PA during TX 32-MHz crystal oscillator pin 1 or external-clock input 32-MHz crystal oscillator pin 2
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CIRCUIT DESCRIPTION
DIGITAL ANALOG MIXED RESET_N XOSC_Q2 XOSC_Q1 P2_4 P2_3 P2_2 P2_1 P2_0 P1_7 P1_6 P1_5 P1_4 P1_3 P1_2 P1_1 P1_0 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 DMA
UNIFIED
RESET
WATCHDOG TIMER
ON-CHIP VOLTAGE REGULATOR POWER ON RESET BROWN OUT
SFR Bus
VDD (2 V-3.6 V) DCOUPL
32-MHz CRYSTAL OSC 32.768-kHz CRYSTAL OSC DEBUG INTERFACE
CLOCK MUX and CALIBRATION
SLEEP TIMER
HIGHSPEED RC-OSC
32-kHz RC-OSC
POWER MANAGEMENT CONTROLLER
PDATA
8051 CPU CORE
XRAM IRAM SFR
RAM
8-KB SRAM
MEMORY ARBITRATOR
FLASH
32/64/128/256-KB FLASH
IRQ CTRL
FLASH CTRL
I/O CONTROLLER
ADC AUDIO/DC
AES ENCRYPTION AND DECRYPTION
RADIO REGISTERS
CSMA/CA STROBE PROCESSOR
USART 0
AGC
DEMODULATOR
MODULATOR
USART 1
RECEIVE CHAIN TIMER 2 (IEEE 802.15.4 MAC TIMER)
FREQUENCY SYNTHESIZER
TIMER 1 (16-Bit)
TRANSMIT CHAIN
TIMER 3 (8-Bit)
TIMER 4 (8-Bit) RF_P RF_N
B0301-02
Figure 7. CC2530 Block Diagram
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FIFO and FRAME CONTROL
RADIO DATA INTERFACE
SFR Bus
SYNTH
CC2530F32, CC2530F64, CC2530F128, CC2530F256
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A block diagram of the CC2530 is shown in Figure 7. The modules can be roughly divided into one of three categories: CPU- and memory-related modules; modules related to peripherals, clocks, and power management; and radio-related modules. In the following subsections, a short description of each module that appears in Figure 7 is given. For more details about the modules and their usage, see the corresponding chapters in the CC253x User's Guide (SWRU191). CPU and Memory The 8051 CPU core used in the CC253x device family is a single-cycle 8051-compatible core. It has three different memory-access buses (SFR, DATA and CODE/XDATA) with single-cycle access to SFR, DATA, and the main SRAM. It also includes a debug interface and an 18-input extended interrupt unit. The interrupt controller services a total of 18 interrupt sources, divided into six interrupt groups, each of which is associated with one of four interrupt priorities. Any interrupt service request is serviced also when the device is in idle mode by going back to active mode. Some interrupts can also wake up the device from sleep mode (power modes 1-3). The memory arbiter is at the heart of the system, as it connects the CPU and DMA controller with the physical memories and all peripherals through the SFR bus. The memory arbiter has four memory access points, access of which can map to one of three physical memories: an 8-KB SRAM, flash memory, and XREG/SFR registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses to the same physical memory. The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The 8-KB SRAM is an ultralow-power SRAM that retains its contents even when the digital part is powered off (power modes 2 and 3). This is an important feature for low-power applications. The 32/64/128/256 KB flash block provides in-circuit programmable non-volatile program memory for the device, and maps into the CODE and XDATA memory spaces. In addition to holding program code and constants, the non-volatile memory allows the application to save data that must be preserved such that it is available after restarting the device. Using this feature one can, e.g., use saved network-specific data to avoid the need for a full start-up and network find-and-join process . Clocks and Power Management The digital core and peripherals are powered by a 1.8-V low-dropout voltage regulator. It provides power management functionality that enables low power operation for long battery life using different power modes. Five different reset sources exist to reset the device. Peripherals The CC2530 includes many different peripherals that allow the application designer to develop advanced applications. The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging. Through this debug interface, it is possible to perform an erasure of the entire flash memory, control which oscillators are enabled, stop and start execution of the user program, execute supplied instructions on the 8051 core, set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possible to perform in-circuit debugging and external flash programming elegantly. The device contains flash memory for storage of program code. The flash memory is programmable from the user software and through the debug interface. The flash controller handles writing and erasing the embedded flash memory. The flash controller allows page-wise erasure and 4-bytewise programming. The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral modules control certain pins or whether they are under software control, and if so, whether each pin is configured as an input or output and if a pullup or pulldown resistor in the pad is connected. CPU interrupts can be enabled on each pin individually. Each peripheral that connects to the I/O pins can choose between two different I/O pin locations to ensure flexibility in various applications.
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A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode, addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs, timers, ADC interface) achieve highly efficient operation by using the DMA controller for data transfers between SFR or XREG addresses and flash/SRAM. Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit period value, and five individually programmable counter/capture channels, each with a 16-bit compare value. Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input signals. It can also be configured in IR Generation Mode where it counts Timer 3 periods and the output is ANDed with the output of Timer 3 to generate modulated consumer IR signals with minimal CPU interaction. The MAC timer (Timer 2) is specially designed for supporting an IEEE 802.15.4 MAC or other time-slotted protocol in software. The timer has a configurable timer period and an 8-bit overflow counter that can be used to keep track of the number of periods that have transpired. A 16-bit capture register is also used to record the exact time at which a start-of-frame delimiter is received/transmitted or the exact time at which transmission ends, as well as a 16-bit output compare register that can produce various command strobes (start RX, start TX, etc.) at specific times to the radio modules. Timer 3 and Timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable prescaler, an 8-bit period value, and one programmable counter channel with an 8-bit compare value. Each of the counter channels can be used as a PWM output. The sleep timer is an ultralow-power timer that counts 32-kHz crystal oscillator or 32-kHz RC oscillator periods. The sleep timer runs continuously in all operating modes except power mode 3. Typical applications of this timer are as a real-time counter or as a wake-up timer to get out of power mode 1 or 2. The ADC supports 7 to 12 bits of resolution in a 30 kHz to 4 kHz bandwidth, respectively. DC and audio conversions with up to eight input channels (Port 0) are possible. The inputs can be selected as single-ended or differential. The reference voltage can be internal, AVDD, or a single-ended or differential external signal. The ADC also has a temperature-sensor input channel. The ADC can automate the process of periodic sampling or conversion over a sequence of channels. The random-number generator uses a 16-bit LFSR to generate pseudorandom numbers, which can be read by the CPU or used directly by the command strobe processor. The random numbers can, e.g., be used to generate random keys used for security. The AES encryption/decryption core allows the user to encrypt and decrypt data using the AES algorithm with 128-bit keys. The core is able to support the AES operations required by IEEE 802.15.4 MAC security, the ZigBee network layer, and the application layer. A built-in watchdog timer allows the CC2530 to reset itself in case the firmware hangs. When enabled by software, the watchdog timer must be cleared periodically; otherwise, it resets the device when it times out. It can alternatively be configured for use as a general 32-kHz timer. USART 0 and USART 1 are each configurable as either a SPI master/slave or a UART. They provide double buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex applications. Each has its own high-precision baud-rate generator, thus leaving the ordinary timers free for other uses. Radio The CC2530 features an IEEE 802.15.4-compliant radio transceiver. The RF core controls the analog radio modules. In addition, it provides an interface between the MCU and the radio which makes it possible to issue commands, read status, and automate and sequence radio events. The radio also includes a packet-filtering and address-recognition module.
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TYPICAL CHARACTERISTICS
RX CURRENT (-100 dBm INPUT) vs TEMPERATURE
28
TX CURRENT (TXPOWER = 0xF5) vs TEMPERATURE
36
27
35
RX Current - mA
TX Current - mA
26
25
34
24
33
23
22 -40
0
40 T - Temperature - C
80
120
G001
32 -40
0
40 T - Temperature - C
80
120
G002
Figure 8. RX CURRENT (-100 dBm INPUT) vs SUPPLY VOLTAGE
26.0 34.4
Figure 9. TX CURRENT (TXPOWER = 0xF5) vs SUPPLY VOLTAGE
25.5 RX Current - mA TX Current - mA 2.4 2.8 3.2 3.6
G003
34.2
25.0
34.0
24.5
33.8
24.0 2.0
33.6 2.0
2.4
2.8
3.2
3.6
G004
VCC - Supply Voltage - V
VCC - Supply Voltage - V
Figure 10.
Figure 11.
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TYPICAL CHARACTERISTICS (continued)
OUTPUT POWER (TXPOWER = 0xF5) vs FREQUENCY
6.0
INTERFERER REJECTION (802.15.4 INTERFERER) vs INTERFERER FREQUENCY (CARRIER AT -82 dBm, 2440 MHz) 75
5.5 PO - Output Power - dBm 50 Interferer Rejection - dB
5.0
25
4.5
0 4.0
3.5 2394
2414
2434
2454
2474
2494
G005
-25 2400
2420
2440
2460
2480
G006
f - Frequency - MHz
Interferer Frequency - MHz
Figure 12. SENSITIVITY vs TEMPERATURE
-92 -93
Figure 13. OUTPUT POWER (TXPOWER = 0xF5) vs TEMPERATURE
8
6
-94 Sensitivity - dBm -95 -96 -97 -98 -99 -40
PO - Output Power - dBm
0 40 T - Temperature - C
G007
4
2
0
80
120
-2 -40
0
40 T - Temperature - C
80
120
G008
Figure 14.
Figure 15.
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TYPICAL CHARACTERISTICS (continued)
OUTPUT POWER (TXPOWER = 0xF5) vs SUPPLY VOLTAGE
5.0 -94
SENSITIVITY vs SUPPLY VOLTAGE
4.8 PO - Output Power - dBm
-95
4.6
Sensitivity - dBm 2.4 2.8 3.2 3.6
G009
-96
-97
4.4
-98
4.2 -99
4.0 2.0
-100 2.0
2.4
2.8
3.2
3.6
G010
VCC - Supply Voltage - V
VCC - Supply Voltage - V
Figure 16.
Figure 17.
Table 1. Recommended Output Power Settings (1)
TXPOWER Register Setting 0xF5 0xE5 0xD5 0xC5 0xB5 0xA5 0x95 0x85 0x75 0x65 0x55 0x45 0x35 0x25 0x15 0x05 0x05 and TXCTRL = 0x09 (1) Typical Output Power (dBm) 4.5 2.5 1 -0.5 -1.5 -3 -4 -6 -8 -10 -12 -14 -16 -18 -20 -22 -28 Typical Current Consumption (mA) 34 31 29 28 27 27 26 26 25 25 25 25 25 24 24 23 23
Measured on Texas Instruments CC2530 EM reference design with TA = 25C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. See [2] for recommended register settings.
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APPLICATION INFORMATION
Few external components are required for the operation of the CC2530. A typical application circuit is shown in Figure 18. Typical values and description of external components are shown in Table 2.
2-V to 3.6-V Power Supply Optional 32-kHz Crystal C331
XTAL2
C321
C401
P2_3/XOSC32K_Q2 33
P2_4/XOSC32K_Q1 32
DCOUPL 40
DVDD1 39
AVDD6 31
P1_6 38
P1_7 37
P2_0 36
P2_1 35
P2_2 34
R301 RBIAS 30 AVDD4 29 AVDD1 28 AVDD2 27 C253 RF_N 26 C251 L252 C252 Antenna (50 W)
1 GND 2 GND 3 GND 4 GND 5 P1_5
CC2530 6 P1_4 7 P1_3 8 P1_2 9 P1_1 10 DVDD2 DIE ATTACH PAD RF_P 25 AVDD3 24 XOSC_Q2 23 XOSC_Q1 22 C262 C261 L261
12 P0_7
13 P0_6
14 P0_5
15 P0_4
16 P0_3
17 P0_2
18 P0_1
19 P0_0
11 P1_0
20 RESET_N
AVDD5 21
XTAL1 Power Supply Decoupling Capacitors are Not Shown Digital I/O Not Connected C221 C231
S0383-01
Figure 18. CC2530 Application Circuit Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors)
Component C251 C261 L252 L261 C262 C252 C253 C331 C321 C231 C221 Description Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network Part of the RF matching network 32kHz xtal loading capacitor 32kHz xtal loading capacitor 32MHz xtal loading capacitor 32MHz xtal loading capacitor Value 18 pF 18 pF 2 nH 2 nH 1 pF 1 pF 2.2 pF 15 pF 15 pF 27 pF 27 pF
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Table 2. Overview of External Components (Excluding Supply Decoupling Capacitors) (continued)
Component C401 R301 Description Decoupling capacitor for the internal digital regulator Resistor used for internal biasing Value 1 F 56 k
Input/Output Matching
When using an unbalanced antenna such as a monopole, a balun should be used to optimize performance. The balun can be implemented using low-cost discrete inductors and capacitors. The recommended balun shown consists of C262, L261, C252, and L252. If a balanced antenna such as a folded dipole is used, the balun can be omitted.
Crystal
An external 32-MHz crystal, XTAL1, with two loading capacitors (C221 and C231) is used for the 32-MHz crystal oscillator. See the 32-MHz Crystal Oscillator section for details. The load capacitance seen by the 32-MHz crystal is given by: 1 + Cparasitic CL = 1 1 + C221 C231 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C321 and C331) used for the 32.768-kHz crystal oscillator. The 32.768-kHz crystal oscillator is used in applications where both very low sleep-current consumption and accurate wake-up times are needed. The load capacitance seen by the 32.768-kHz crystal is given by: 1 + Cparasitic CL = 1 1 + C321 C331 (2) A series resistor may be used to comply with the ESR requirement.
On-Chip 1.8-V Voltage-Regulator Decoupling
The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires a decoupling capacitor (C401) for stable operation.
Power-Supply Decoupling and Filtering
Proper power-supply decoupling must be used for optimum performance. The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the best performance in an application. TI provides a compact reference design that should be followed very closely.
References
1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf 2. CC253x User's Guide - CC253x System-on-Chip Solution for 2.4 GHz IEEE 802.15.4 and ZigBee Applications (SWRU191)
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Additional Information
Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. Our selection includes RF transceivers, RF transmitters, RF front ends, and System-on-Chips as well as various software solutions for the sub-1- and 2.4-GHz frequency bands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with fellow engineers from all over the world. With a broad selection of product solutions, end application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. We make RF easy! The following subsections point to where to find more information.
Texas Instruments Low-Power RF Web Site
Texas Instruments' Low-Power RF Web site has all our latest products, application and design notes, FAQ section, news and events updates, and much more. Just go to www.ti.com/lprf.
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* * * Forums, videos, and blogs RF design help E2E interaction
Join us today at www.ti.com/lprf-forum.
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Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including: * RF circuit, low-power RF, and ZigBee design services * Low-power RF and ZigBee module solutions and development tools * RF certification services and RF circuit manufacturing Need help with modules, engineering services or development tools? Search the Low-Power RF Developer Network tool to find a suitable partner. www.ti.com/lprfnetwork
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PACKAGE OPTION ADDENDUM
www.ti.com 18-May-2009
PACKAGING INFORMATION
Orderable Device CC2530F128RHAR CC2530F128RHAT CC2530F256RHAR CC2530F256RHAT CC2530F32RHAR CC2530F32RHAT CC2530F64RHAR CC2530F64RHAT
(1)
Status (1) ACTIVE ACTIVE ACTIVE ACTIVE PREVIEW PREVIEW PREVIEW PREVIEW
Package Type QFN QFN QFN QFN QFN QFN QFN QFN
Package Drawing RHA RHA RHA RHA RHA RHA RHA RHA
Pins Package Eco Plan (2) Qty 40 40 40 40 40 40 40 40 2500 Green (RoHS & no Sb/Br) 250 Green (RoHS & no Sb/Br)
Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI Call TI
MSL Peak Temp (3) Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Call TI Call TI Call TI Call TI
2500 Green (RoHS & no Sb/Br) 250 2500 250 2500 250 Green (RoHS & no Sb/Br) TBD TBD TBD TBD
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 18-May-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins Type Drawing QFN QFN QFN QFN RHA RHA RHA RHA 40 40 40 40
SPQ
Reel Reel Diameter Width (mm) W1 (mm) 330.0 330.0 330.0 330.0 16.4 16.4 16.4 16.4
A0 (mm)
B0 (mm)
K0 (mm)
P1 (mm) 12.0 12.0 12.0 12.0
W Pin1 (mm) Quadrant 16.0 16.0 16.0 16.0 Q2 Q2 Q2 Q2
CC2530F128RHAR CC2530F128RHAT CC2530F256RHAR CC2530F256RHAT
2500 250 2500 250
6.3 6.3 6.3 6.3
6.3 6.3 6.3 6.3
1.5 1.5 1.5 1.5
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 18-May-2009
*All dimensions are nominal
Device CC2530F128RHAR CC2530F128RHAT CC2530F256RHAR CC2530F256RHAT
Package Type QFN QFN QFN QFN
Package Drawing RHA RHA RHA RHA
Pins 40 40 40 40
SPQ 2500 250 2500 250
Length (mm) 333.2 333.2 333.2 333.2
Width (mm) 345.9 345.9 345.9 345.9
Height (mm) 28.6 28.6 28.6 28.6
Pack Materials-Page 2
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